AWG G3 PAD FOR PS3 Especificaciones descargar pdf (Pagina 109)

Wafer Prober DUT Board and Probe Card 4 Test Head Filling and DUT Board Considerations

System Reference, January 2001

109

input-output pogo pads on the

probe card

The lightly shaded grey area of Figure 48 on page 108

contains the pogo pads of the input -output signal lines

(circles with numbers).

The small white dots between the signal pads are the

ground pads.

The area consists of 8 units as indicated by the dashed

lines.

Each unit contains 16 of those signal lines.

The pogo pads of the signal lines contained in one unit are

all connected to the same pogo pad block within the

groups on the wafer prober DUT board.

The numbers given to each unit are shown in Figure 47 on

page 107. These numbers are the same as for their origin

pogo pad blocks within the groups on the wafer prober

DUT board. For the numbering of the pogo pad blocks

within the rectangularly shaped groups see Figure 31 on

page 64(512 pins) and Figure 32 on page 65(1024 pins).

Though, the numbering of the pogo pad blocks is illus-

trated for packaged parts DUT boards, there, it is the same

for the wafer prober DUT boards.

The signal line pogo pads of the units are given the same

numbers (see Figure 48 on page 108) as for the pogo pads

of the signal line pogo pads within the the pad blocks (see

Figure 33 on page 67).

1 2 ... 104 105 106 107 108 109 110 111 112 113 114 ... 284 285

Sin comentarios

AWG G3 PAD FOR PS3 Especificaciones Pagina 109