AWG G3 PAD FOR PS3 Especificaciones descargar pdf (Pagina 105)

Wafer Prober DUT Board and Probe Card 4 Test Head Filling and DUT Board Considerations

System Reference, January 2001

105

DUT Board of Wafer Prober

See also drawings

D-E7018-96504-1S12B (512

pins) and

D-E7018-96501-1S12B (1024

pins)

For the SOC pogo tower there are two wafer prober DUT

boards:

1. a 512 pin wafer prober DUT board.

2. a 1024 pin wafer prober DUT board.

In Figure 45 on page 104, you are given a schematic

drawing of an 1024 pin wafer prober DUT board. The area

surrounded with the black line in the middle of the 1024

pin wafer prober DUT board is equivalent to a 512 pin

wafer prober DUT board.

The heavily shaded grey boxes in the two rows, one in the

top and the other in the bottom half of the illustrated

board, are so called half groups. These half groups are the

areas where the pogo pads connect to the test head via

the DUT interface. A half group each consists of four pairs

of pad blocks of 17 signal lines each, see also “Pad Blocks”

on page 67. Additional, each half group contains pads for

the DPS and for the utility lines.

Always two of these rectangularly arranged half groups of

pogo pads are projected to one segment in the circularly

shaped area in the middle of the wafer prober DUT board.

Each segment only contains pogo pads of those two half

groups which build a group. For the numbering of the

groups see Figure 32 on page 65 which is the same as of

the probe card segments (see Figure 47 on page 107).

In case of the 512 pin DUT board only the four black

segments are in use as this wafer prober DUT board only

consists of the four groups of pogo pads of the area

surrounded in black.

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AWG G3 PAD FOR PS3 Especificaciones Pagina 105